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US 12,183,548 B2Granted
High bandwidth architecture for centralized coherent control at the edge of processing tool
AssigneeApplied Materials, Inc.
InventorDavid Coumou
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include a processing tool. In an embodiment, the processing tool comprises a power supply, an impedance matching network coupled to the power supply, a cathode, wherein the power supply is configured to supply power through the impedance matching network to the cathode, and a processing module, wherein the processing module is communicatively coupled to the power supply and the impedance matching network.
Claims18
A processing tool, comprising:
- a power supply;
- an impedance matching network coupled to the power supply;
- a cathode, wherein the power supply is configured to supply power through the impedance matching network to the cathode;
- a processing module, wherein the processing module is communicatively coupled to the power supply and the impedance matching network;
- a first sensor upstream of the impedance matching network;
- and
- a second sensor downstream of the impedance matching network, the second sensor between the impedance matching network and the cathode.
4 more elements
A process power control module, comprising:
- an RF platform board;
- a carrier card for an analog to digital converter (ADC), the carrier card coupled to the RF platform board;
- a heterogeneous computing module (HCM), the HCM coupled to the RF platform board;
- a programmable logic board, the programmable logic board coupled to the RF platform board;
- a real time processing unit (RTPU), the RTPU coupled to the RF platform board;
- and
- a messaging controller, the messaging controller coupled to the RF platform board.
4 more elements
A semiconductor processing tool, comprising:
- a power supply;
- an impedance matching network coupled to the power supply;
- a cathode, wherein the power supply is configured to supply power through the impedance matching network to the cathode;
- and
- a processing module, wherein the processing module is communicatively coupled to the power supply and the impedance matching network, and wherein the processing module comprises:
- an RF platform board;
- a carrier card for an analog to digital converter (ADC), the carrier card coupled to the RF platform board;
- a heterogeneous computing module (HCM), the HCM coupled to the RF platform board;
- a programmable logic board, the programmable logic board coupled to the RF platform board;
- a real time processing unit (RTPU), the RTPU coupled to the RF platform board;
- and
- a messaging controller, the messaging controller coupled to the RF platform board;
- and
- a first sensor upstream of the impedance matching network;
- and
- a second sensor downstream of the impedance matching network, the second sensor between the impedance matching network and the cathode.
13 more elements
Dependencies are inferred from the claim text.