Charged particle beam system and overlay misalignment measurement method
AssigneeHitachi High-Tech Corporation
InventorTakuma Yamamoto
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AssigneeHitachi High-Tech Corporation
InventorTakuma Yamamoto
Estimating the term…
In the present invention, an overlay misalignment is quickly measured. An image generation unit generates an image on the basis of signals from a detector. A matching processing unit identifies, by means of matching processing with a template image, the position of an overlay measurement pattern in the image generated by the image generation unit. A line profile generation unit generates, by scanning the overlay pattern, a first line profile pertaining to a secondary electron signal and a second line profile pertaining to a backscattered electron signal. An overlay misalignment measurement unit identifies the position of a first pattern in the overlay measurement pattern from the first line profile, identifies the position of a second pattern in the overlay measurement pattern from the second line profile, and measures an overlay misalignment in a sample on the basis of the position of the first pattern and the position of the second pattern.
A charged particle beam system comprising:
An overlay misalignment measurement method for measuring the amount of overlay misalignment between different layers of a sample based on a signal detected by a detector by irradiating the sample with a charged particle beam, the method comprising:
Dependencies are inferred from the claim text.