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US 12,183,498 B2Granted
Power conversion device
AssigneeMitsubishi Electric Corporation
InventorsHiroyuki Kiyonaga, Kenta Fujii, Yuji Shirakata, Tomohito Fukuda
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Abstract
A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board.
Claims17
A power conversion device comprising:
- an electronic component including a first component and a second component;
- a first substrate including a first principal surface on which the first component of the electronic component is mounted and a second principal surface opposite to the first principal surface;
- a first cooling body thermally connected to the second principal surface of the first substrate;
- a second substrate including a third principal surface on which the second component of the electronic component is mounted and a fourth principal surface opposite to the third principal surface;
- and
- a second cooling body thermally connected to the fourth principal surface of the second substrate, wherein
- the first cooling body forms a bottom surface of a support body,
- the second cooling body forms a side surface of the support body,
- the second cooling body extends in a direction from the second principal surface of the first substrate toward the first principal surface, and
- the second substrate is disposed on a surface of the second cooling body facing the first substrate.
7 more elements
A power conversion device comprising:
- an electronic component including a first component, a second component, and a third component;
- a first substrate including a first principal surface on which the first component of the electronic component is mounted and a second principal surface opposite to the first principal surface;
- a first cooling body thermally connected to the second principal surface of the first substrate;
- a second substrate including a third principal surface on which the second component of the electronic component is mounted and a fourth principal surface opposite to the third principal surface;
- a second cooling body thermally connected to the fourth principal surface of the second substrate;
- a third substrate including a fifth principal surface on which the third component of the electronic component is mounted and a sixth principal surface opposite to the fifth principal surface;
- and
- a third cooling body thermally connected to the sixth principal surface of the third substrate, wherein
- the second cooling body extends in a direction from the second principal surface of the first substrate toward the first principal surface,
- the third cooling body extends in the direction from the second principal surface of the first substrate toward the first principal surface, and
- the second substrate and the third substrate are disposed to face each other.
8 more elements
Dependencies are inferred from the claim text.