Test pad and chip on film package including the same
AssigneeLx Semicon Co., Ltd.
InventorsSeung Hoon Jin, Young Min Choi
Life of this patent
Estimating the term…
Abstract
A chip on film (COF) package in which a predetermined driving integrated circuit (IC) is mounted includes a wiring structure connected to the driving IC, and a test pad connected to the wiring structure, wherein the test pad includes a base film divided into a first region and a second region, and a conductive layer located in the first region, and the second region is surrounded by the first region in a plan view.
Claims17
A test pad for testing a chip on film (COF) package on which a driving integrated circuit (IC) is mounted, the test pad comprising:
- a base film divided into a first region and a second region;
- and
- a conductive layer located in the first region, wherein
- the second region is surrounded by the first region in a plan view, and
- the second region does not overlap the driving IC.
A chip on film (COF) package in which a driving integrated circuit (IC) is mounted, the COF package comprising:
- a wiring structure connected to the driving IC;
- and
- a test pad connected to the wiring structure, wherein
- the test pad includes a base film divided into a first region and a second region, and a conductive layer located in the first region,
- the second region is surrounded by the first region in a plan view, and
- the second region does not overlap the driving IC.
Dependencies are inferred from the claim text.