Temperature control component for electronic systems wherein a thermal transfer component is tappered

A system to test a plurality of electronic devices under a variety of thermal conditions, the system comprising:

• an electronic system comprising the plurality of electronic devices;
• and
• a temperature control component comprising:
• a first thermoelectric component (TEC);
• a second TEC;
• a thermal transfer component disposed between the first TEC and the second TEC, wherein the thermal transfer component is tapered between a first surface that is thermally coupled to the first TEC and a second surface that is thermally coupled to the second TEC;
• and
• a thermal conduction layer coupled to the second TEC, wherein the thermal conduction layer comprises a planar area configured to be positioned above two or more electronic devices of the plurality of electronic devices of the electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component.