Apparatus and methods for optical interconnects

An apparatus comprising:

• a first optical interconnect structure;
• a second optical interconnect structure;
• and
• a fiber array that optically couples the first optical interconnect structure to the second optical interconnect structure,
• wherein each of the first and second optical interconnect structures, comprises:
• a substrate;
• an electronic die;
• a photonics die, wherein a first portion of the electronic die is disposed on top of the photonics die and a second portion of the electronic die disposed on top of the substrate, wherein the photonics die is positioned between the first portion of the electronic die and the substrate;
• a socket disposed beneath the substrate;
• a board disposed beneath the socket;
• at least one waveguide formed in the board;
• at least one first micro-lens formed beneath the photonics die and extending from a bottom surface of the photonics die into a first hole formed in the substrate;
• at least one second micro-lens formed on a top surface of the board and disposed below a bottom surface of the socket, wherein the at least one first micro-lens and the at least one second micro-lens is optically coupled via the first hole formed in the substrate and a second hole formed in the socket, wherein the first hole and the second hole are vertically aligned;
• and
• at least one mirror installed formed below the top surface of the board and optically aligned to the at least one second micro-lens and optically aligned to the at least one waveguide.

An apparatus comprising:

• a substrate;
• an electronic die;
• a photonics die disposed below the electronic die;
• a heat spreader above the electronic die and attached to the substrate;
• a socket disposed beneath the substrate;
• a board disposed beneath the socket;
• at least one waveguide formed in the board;
• at least one first micro-lens formed beneath the photonics die and extending from a bottom surface of the photonics die into a first hole formed in the substrate;
• at least one second micro-lens formed on a top surface of the board and disposed below a bottom surface of the socket, wherein the at least one first micro-lens and the at least one second micro-lens are optically coupled via the first hole formed in the substrate and a second hole formed in the socket, wherein the first hole and the second hole are vertically aligned;
• and
• at least one mirror formed below the top surface of the board and optically aligned to the at least one second micro-lens and optically aligned to the at least one waveguide,
• wherein the at least one first micro-lens is optically coupled to the at least one second micro-lens, which in turn is optically coupled to the at least one mirror, which in turn is optically coupled to the at least one waveguide, respectively.