Semiconductor device with interface structure

A semiconductor device, comprising:

• an interface board fixed onto and electrically coupled to a chuck of a testing equipment;
• and
• a first object positioned on a first surface of the interface board and electrically coupled to the interface board;
• a through board via disposed in the interface board;
• wherein the interface board includes a lower connector positioned on a second surface of the interface board, the second surface is opposite to the first surface and is faced toward the chuck, and the chuck of the testing equipment includes a resilient connecting unit faced toward the second surface of the interface board and electrically coupled with the lower connector;
• wherein a board pad is disposed between the second surface of the interface board and the chuck of the testing equipment, the board pad is electrically coupled to the lower connector and the through board via and the board pad is contacted with the lower connector and the through board via, wherein a width of the board pad is greater than a width of the through board via;
• wherein the first object is analyzed by the testing equipment;
• wherein the through board via is disposed between the first surface and the second surface of the interface board and the through board via is electrically coupled with the resilient connecting unit of the chuck of the testing equipment via the board pad and the lower connector.