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US 12,181,230 B2Granted
Liquid cooling structure and liquid cooling system including the liquid cooling structure
AssigneeSK hynix Inc.
InventorsNam Hyeon Choi, Seung Jin Ryu, Jeong Bae Jeon
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Abstract
A liquid cooling structure may include a lower structure and an upper structure. The lower structure may be configured to cover one surface of an object. The upper structure may be combined with the lower structure to provide a channel through which a cooling fluid may flow. The channel may include a plurality of passages connected between a channel inlet through which the cooling fluid may enter and a channel outlet through which the cooling fluid may exits.
Claims17
A liquid cooling structure for cooling a memory module, the liquid cooling structure comprising:
- a lower structure configured to cover one surface of the memory module;
- and
- an upper structure combined with the lower structure to form a channel through which a cooling fluid flows,
- wherein the channel comprises an inlet of the channel where the cooling fluid enters, n passages branched at a region adjacent to the inlet of the channel, a connection passage where the n passages join, m passages re-branched at the connection passage and an outlet of the channel where the cooling fluid exits,
- wherein the channel is divided into an upstream region where the n passages are arranged, and a downstream region where the m passages are arranged based on the connection passage, and
- wherein “n” is a natural number greater than or equal to 1 and “m” is a natural number greater than the “n”.
3 more elements
Dependencies are inferred from the claim text.