Cover plate for covering the susceptor side facing the process chamber of a device for depositing SiC layers

A susceptor arrangement for a device for depositing layers on a plurality of substrates (8), the susceptor arrangement comprising:

• a susceptor (1);
• and
• a plurality of cover plates (10, 15, 16), enclosing the plurality of substrates (8), that are arranged on a surface of the susceptor (1) that faces a process chamber,
• wherein the plurality of cover plates (10, 15, 16) comprise a plurality of inner cover plates (10),
• wherein each of the plurality of inner cover plates (10) forms an outer edge (24) that borders an edge (8′) of one or more of the plurality of substrates (8) facing a center (M) of the susceptor (1),
• wherein two of the plurality of inner cover plates (10), which are arranged adjacent to one another about the center (M) of the susceptor (1) in a circumferential direction, border one another at a linearly extending separation joint (11),
• wherein the linearly extending separation joint (11) is angularly offset by an angle (α) relative to a first radial line (12) that extends through the center (M) of the susceptor (1) and a center (13) of one of the plurality of substrates (8) in a radial direction, and
• wherein an intersecting point (14) between a linear line (11′) drawn through the linearly extending separation joint (11) and the first radial line (12) lies radially outside of the center (M) of the susceptor (1).