Coating method and film layer thereof, and coating fixture and application thereof
AssigneeJiangsu Favored Nanotechnology Co., Ltd.
InventorsJian Zong, Ji Peng, Yingjing Dai, Wei Shan, Zhuyao Lan
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AssigneeJiangsu Favored Nanotechnology Co., Ltd.
InventorsJian Zong, Ji Peng, Yingjing Dai, Wei Shan, Zhuyao Lan
Estimating the term…
Provided in the present disclosure are a coating method and a film layer thereof, and a coating chucking appliance and an application thereof. The coating method comprises the steps of: forming a normal film layer on a first component on a substrate surface, and forming at least a thinner film layer on a second component on the substrate surface, wherein the thickness of the normal film layer is greater than the thickness of the thinner film layer. The coating method can prepare a thinner film layer on the surface of some portions or parts on the substrate surface, and prepare a thicker film layer on the surface of other portions or parts, thereby satisfying the requirements of coating a thinner film layer on some electronic components of the substrate, such as circuit interface components, ensuring data transmission performance.
A coating chucking appliance, comprising:
Dependencies are inferred from the claim text.