Sensor package and method of producing the sensor package
AssigneeSciosense B.V.
InventorsWillem Frederik Adrianus Besling, Casper Van Der Avoort, Coenraad Cornelis Tak, Remco Henricus Wilhelmus Pijnenburg, Olaf Wunnicke, Hendrik Bouman
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Abstract
A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.
Claims16
A method for producing a sensor package, the method comprising:
- providing a carrier including electric conductors;
- fastening a dummy die or an interposer to the carrier;
- providing an application specific integrated circuit (ASIC) device comprising an integrated sensor element;
- and
- fastening the ASIC device to the dummy die or the interposer,
- wherein the dummy die or the interposer is unstructured and electrically inactive,
- wherein the ASIC device is fastened to the dummy die or the interposer by an adhesive layer,
- wherein the ASIC device laterally overhangs the dummy die or the interposer,
- wherein the sensor element is arranged on a portion of the ASIC device that laterally overhangs the dummy die or the interposer,
- wherein the adhesive layer directly adjoins the ASIC device, and
- wherein the adhesive layer directly adjoins the dummy die or the interposer.
A method for producing a sensor package, the method comprising:
- providing a carrier including electric conductors;
- fastening a dummy die to the carrier;
- providing an application specific integrated circuit (ASIC) device comprising an integrated sensor element;
- and
- fastening the ASIC device to the dummy die,
- wherein the dummy die is unstructured and electrically inactive,
- wherein the ASIC device is fastened to the dummy die by an adhesive layer,
- wherein the ASIC device laterally overhangs the dummy die,
- wherein the sensor element is arranged on a portion of the ASIC device that laterally overhangs the dummy die,
- wherein the adhesive layer directly adjoins the ASIC device, and
- wherein the adhesive layer directly adjoins the dummy die.
A method for producing a sensor package, the method comprising:
- providing a carrier including electric conductors;
- fastening an interposer to the carrier;
- providing an application specific integrated circuit (ASIC) device comprising an integrated sensor element;
- and
- fastening the ASIC device to the interposer,
- wherein the interposer is unstructured and electrically inactive,
- wherein the ASIC device is fastened to the interposer by an adhesive layer,
- wherein the ASIC device laterally overhangs the interposer,
- wherein the sensor element is arranged on a portion of the ASIC device that laterally overhangs the interposer,
- wherein the adhesive layer directly adjoins the ASIC device, and
- wherein the adhesive layer directly adjoins the interposer.
Dependencies are inferred from the claim text.