A resin supply apparatus for supplying, onto a release film, a resin used for sealing a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively, the resin supply apparatus comprising:
- an acquisition unit configured to acquire arrangement information of the elements on the workpiece by imaging the workpiece and analyzing the image of the workpiece;
- a supply unit configured to supply a resin onto the release film;
- a calculation unit configured to calculate a resin supply pattern by reading the registered arrangement information by the acquisition unit, and to calculate a desired moving pattern of the supply unit;
- and
- a drive unit configured to move at least one of the release film and the supply unit relative to the other along the resin supply pattern,
- wherein the resin supply pattern has a plurality of linear paths extending along the first direction, and
- a region between mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the release film.