Apparatus for polishing, processing system, and method of polishing

An apparatus for polishing, comprising:

• a table configured to support a polishing pad;
• a polishing head configured to hold an object;
• and
• a polishing solution supply device configured to supply a polishing solution between the polishing pad and the object,
• the apparatus causing the polishing pad and the object to be in contact with each other and to be rotated relative to each other in presence of the polishing solution and thereby polishes the object, wherein
• the polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the object, and
• the polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution,
• wherein the polishing solution supply device has the plurality of polishing solution supply ports formed in an equal distance range from a corresponding position on a trajectory of rotation of the polishing pad corresponding to a center of rotation of the object toward positions corresponding to respective outer circumferences of the object and configured to supply the polishing solution such as to increase a flow rate of the polishing solution in the range from the corresponding position on the trajectory of rotation of the polishing pad corresponding to the center of rotation of the object toward the positions corresponding to the respective outer circumferences of the object, and
• wherein the plurality of polishing solution supply ports have opening centers thereof arranged at equal intervals and have opening diameters increasing by discrete predetermined fixed number steps, from the corresponding position on the trajectory of rotation of the polishing pad corresponding to the center of rotation of the object toward the positions corresponding to the respective outer circumferences of the object.

An apparatus for polishing, comprising:

• a table configured to support a polishing pad;
• a polishing head configured to hold an object;
• and
• a polishing solution supply device configured to supply a polishing solution between the polishing pad and the object,
• the apparatus causing the polishing pad and the object to be in contact with each other and to be rotated relative to each other in presence of the polishing solution and thereby polishes the object, wherein
• the polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the object, and
• the polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution,
• wherein the polishing solution supply device has the plurality of polishing solution supply ports formed in a range corresponding to a radius of the object on a side nearer to a center of rotation of the polishing pad and configured to supply the polishing solution such as to increase a flow rate of the polishing solution in the range from a corresponding position on a trajectory of rotation of the polishing pad corresponding to a center of rotation of the object toward a position corresponding to an outer circumference of the object on the side nearer to the center of rotation of the polishing pad, and
• wherein the plurality of polishing solution supply ports have opening centers thereof arranged at equal intervals and have opening diameters increasing by discrete predetermined fixed number steps, from the corresponding position on the trajectory of rotation of the polishing pad corresponding to the center of rotation of the object toward the position corresponding to the outer circumference of the object on the side nearer to the center of rotation of the polishing pad.

An apparatus for polishing, comprising:

• a table configured to support a polishing pad;
• a polishing head configured to hold an object;
• and
• a polishing solution supply device configured to supply a polishing solution between the polishing pad and the object,
• the apparatus causing the polishing pad and the object to be in contact with each other and to be rotated relative to each other in presence of the polishing solution and thereby polishes the object, wherein
• the polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the object, and
• the polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution,
• wherein the polishing solution supply device has the plurality of polishing solution supply ports formed in an equal distance range from a corresponding position on a trajectory of rotation of the polishing pad corresponding to a center of rotation of the object toward positions corresponding to respective outer circumferences of the object and configured to supply the polishing solution such as to increase a flow rate of the polishing solution in the range from the corresponding position on the trajectory of rotation of the polishing pad corresponding to the center of rotation of the object toward the positions corresponding to the respective outer circumferences of the object, and
• wherein the plurality of polishing solution supply ports have an identical opening diameter and have intervals of the respective polishing solution supply ports decreasing by discrete predetermined fixed number steps, from the corresponding position on the trajectory of rotation of the polishing pad corresponding to the center of rotation of the object toward the positions corresponding to the respective outer circumferences of the object.

An apparatus for polishing, comprising:

• a table configured to support a polishing pad;
• a polishing head configured to hold an object;
• and
• a polishing solution supply device configured to supply a polishing solution between the polishing pad and the object,
• the apparatus causing the polishing pad and the object to be in contact with each other and to be rotated relative to each other in presence of the polishing solution and thereby polishes the object, wherein
• the polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the object, and
• the polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution,
• wherein the polishing solution supply device has the plurality of polishing solution supply ports formed in a range corresponding to a radius of the object on a side nearer to a center of rotation of the polishing pad and configured to supply the polishing solution such as to increase a flow rate of the polishing solution in the range from a corresponding position on a trajectory of rotation of the polishing pad corresponding to a center of rotation of the object toward a position corresponding to an outer circumference of the object on the side nearer to the center of rotation of the polishing pad, and
• wherein the plurality of polishing solution supply ports have an identical opening diameter and have intervals of the respective polishing solution supply ports decreasing by discrete predetermined fixed number steps, from the corresponding position on the trajectory of rotation of the polishing pad corresponding to the center of rotation of the object toward the position corresponding to the outer circumference of the object on the side nearer to the center of rotation of the polishing pad.

An apparatus for polishing, comprising:

• a table configured to support a polishing pad;
• a polishing head configured to hold an object;
• and
• a polishing solution supply device configured to supply a polishing solution between the polishing pad and the object,
• the apparatus causing the polishing pad and the object to be in contact with each other and to be rotated relative to each other in presence of the polishing solution and thereby polishes the object, wherein
• the polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the object, and
• the polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution,
• wherein the polishing solution supply device has the plurality of polishing solution supply ports formed in a range corresponding to a diameter of the object and configured to supply the polishing solution such as to increase a flow rate of the polishing solution in the range from a position corresponding to an outer circumference of the object on a side nearer to a center of rotation of the polishing pad toward a position corresponding to an outer circumference of the object on a side farther from the center of rotation of the polishing pad, and
• wherein the plurality of polishing solution supply ports have opening centers thereof arranged at equal intervals and have opening diameters increasing by discrete predetermined fixed number of steps, from the position corresponding to the outer circumference of the object on the side nearer to the center of rotation of the polishing pad toward the position corresponding to the outer circumference of the object on the side farther from the center of rotation of the polishing pad.

An apparatus for polishing, comprising:

• a table configured to support a polishing pad;
• a polishing head configured to hold an object;
• and
• a polishing solution supply device configured to supply a polishing solution between the polishing pad and the object,
• the apparatus causing the polishing pad and the object to be in contact with each other and to be rotated relative to each other in presence of the polishing solution and thereby polishes the object, wherein
• the polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the object, and
• the polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution,
• wherein the polishing solution supply device has the plurality of polishing solution supply ports formed in a range corresponding to a diameter of the object and configured to supply the polishing solution such as to increase a flow rate of the polishing solution in the range from a position corresponding to an outer circumference of the object on a side nearer to a center of rotation of the polishing pad toward a position corresponding to an outer circumference of the object on a side farther from the center of rotation of the polishing pad, and
• wherein the plurality of polishing solution supply ports have an identical opening diameter and have intervals of the respective polishing solution supply ports decreasing by a discrete predetermined fixed number of steps, from the position corresponding to the outer circumference of the object on the side nearer to the center of rotation of the polishing pad toward the position corresponding to the outer circumference of the object on the side farther from the center of rotation of the polishing pad.