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US 12,177,986 B2Granted
Component and method for manufacturing a component
AssigneeTDK Electronics Co., Ltd.
InventorsJan Ihle, Thomas Bernert, Stefan Endler, Michael Krenn, Stephan Bigl, Markus Puff, Sebastian Redolfi
Life of this patent
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Abstract
In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.
Claims14
A component comprising:
- at least one carrier layer having a top side and a bottom side;
- at least one functional layer arranged on the top side of the carrier layer, the functional layer comprising a material having a specific electrical characteristic;
- at least two cover electrodes configured for electrically contacting the functional layer from a top side of the functional layer,
- wherein the cover electrodes are arranged next to one another and are spatially and electrically separated from one another by at least one recess or a comb-like structure, and
- wherein the cover electrodes are arranged directly on the functional layer;
- at least one feedthrough completely penetrating the carrier layer and the functional layer such that the feedthrough extends from the top side of the functional layer through the functional layer and the carrier layer to the bottom side of the carrier layer;
- and
- at least one contact element arranged on the bottom side of the carrier layer, the at least one contact element configured for electrically contacting of the component,
- wherein the component is configured for direct integration into an electrical system as a discrete component.
6 more elements
Dependencies are inferred from the claim text.