Distributed multi-die protocol application interface
AssigneeAltera Corporation
InventorsGary Brian Wallichs, Keith Duwel, Cora Lynn Mau
Life of this patent
Estimating the term…
Abstract
Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
Claims20
A single package multi-die electronic device comprising:
- a communication bus comprising a plurality of channels;
- a first die comprising a first bus interface coupled to the communication bus;
- and
- a second die comprising:
- a second bus interface coupled to the communication bus;
- and
- data processing circuitry configurable to exchange data with the first die over the communication bus, wherein the plurality of channels comprises:
- a first set of unidirectional channels extending from the first bus interface to the second bus interface;
- or
- a second set of unidirectional channels extending from the second bus interface to the first bus interface.
A system comprising:
- a memory device;
- a communication bus comprising a plurality of channels;
- an input/output (I/O) die comprising a first bus interface coupled to the communication bus;
- and
- an integrated circuit die comprising:
- a second bus interface coupled to the communication bus;
- and
- data processing circuitry configurable to exchange data with the IO die over the communication bus, wherein the plurality of channels comprises:
- a first set of unidirectional channels extending from the first bus interface to the second bus interface;
- or
- a second set of unidirectional channels extending from the second bus interface to the first bus interface.
An electronic device comprising:
- a communication bus comprising a plurality of channels;
- an input/output (I/O) die comprising a first bus interface coupled to the communication bus;
- and
- an integrated circuit die comprising:
- a second bus interface coupled to the communication bus;
- and
- data processing circuitry configurable to exchange data with the IO die over the communication bus, wherein the plurality of channels comprises:
- a first set of unidirectional channels extending from the first bus interface to the second bus interface;
- or
- a second set of unidirectional channels extending from the second bus interface to the first bus interface.
Dependencies are inferred from the claim text.