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US 12,134,714 B2Granted
Thermosetting adhesive and adhesive sheet
AssigneeNitto Shinko Corporation
InventorsYoshiki Takahashi, Risako Tokunaga
Life of this patent
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Abstract
Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.
Claims8
A thermosetting adhesive comprising:
- an adhesive component, wherein
- dynamic viscoelasticity spectrum of a cured product obtained by curing the thermosetting adhesive has a peak indicating a softening temperature at 200° C. or higher and has no peak at 160° C. or lower,
- the adhesive component comprises a polyurethane, an isocyanate, and an epoxy chemically bonded to each other to form an epoxy-modified polyurethane,
- the polyurethane has a carboxyl group, and
- the adhesive component further comprises a phenoxy resin.
2 more elements
Dependencies are inferred from the claim text.