Method and apparatus for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser

A method for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser, comprising:

• step a) generating a beam of writing light laser based on a writing light laser;
• step b) generating multiple writing light beams propagating in different diffraction directions based on a writing light optical diffractometer;
• step c) generating a beam of inhibited light laser based on an inhibited light laser;
• step d) generating multiple inhibited light beams propagating in different diffraction directions based on an inhibited light optical diffractometer;
• step e) combining the writing light beams and the inhibited light beams based on a dichroic mirror to form modulated multiple beams;
• step f) modulating an arrangement direction of the multiple beams based on an image rotator;
• step g) moving at a constant speed in a longitudinal direction based on a displacement stage;
• step h) transversely high-speed-scanning the multiple beams based on a rotating mirror;
• step i) outputting a multichannel writing waveform based on a multichannel high-speed optical switch;
• step j) the displacement stage moving at a constant speed until writing of a whole column of areas is completed, turning off an optical switch, and step-moving the displacement stage for one time;
• and
• step k) repeating the steps e)-j) until all patterns are written.