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US 12,122,944 B2Granted
Hot melt adhesive composition
AssigneeResonac Corporation
InventorYuzuru Takahashi
Life of this patent
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Abstract
A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.
Claims8
A hot melt adhesive composition, containing:
- a 1-butene homopolymer;
- an ethylene-based polymer having a melting point of lower than 80° C.;
- an α-olefin copolymer having a melting point of 80° C. or higher;
- a tackifying resin;
- wax;
- and
- a liquid softener,
- wherein the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene·α-olefin copolymer and an ethylene· vinyl acetate copolymer.
5 more elements
Dependencies are inferred from the claim text.