Display panel, method for manufacturing same, and display device with improved stress absorbing capacity

A method for manufacturing a display panel, comprising:

• forming a drive backplane, wherein the drive backplane comprises a pixel circuit region and a peripheral region disposed outside the pixel circuit region, the peripheral region comprising a bending region;
• wherein the bending region and the pixel circuit region are sequentially arranged along a first direction, and the bending region is provided with at least one isolation trench arranged along a second direction, the second direction being intersected with the first direction, and each of the at least one isolation trench extending through the drive backplane;
• and
• forming a stress absorbing layer in the bending region, wherein the stress absorbing layer comprises a plurality of absorbing portions arranged along the second direction, at least one of the plurality of absorbing portions being provided on both sides of each of the at least one isolation trench,
• wherein the isolation trench comprises an open end and a closed end that are arranged along the first direction, the closed end being proximal to the pixel circuit region relative to the open end, and wherein the isolation trench comprises a first trench wall and a second trench wall that are arranged in parallel, and a bottom wall configured to connect the first trench wall and the second trench wall, the bottom wall being in smooth transition with the first trench wall and the second trench wall, the bottom wall is in an arc shape, and a distance between the first trench wall and the second trench wall is greater than or equal to twice a radius of the bottom wall.

A display device, comprising a power supply component and a display panel;

• wherein
• the power supply component is configured to supply power to the display panel, and the display panel comprises a drive backplane and a stress absorbing layer;
• wherein
• the drive backplane comprises a pixel circuit region and a peripheral region disposed outside the pixel circuit region, the peripheral region comprising a bending region;
• wherein the bending region and the pixel circuit region are sequentially arranged along a first direction, and the bending region is provided with at least one isolation trench arranged along a second direction, the second direction being intersected with the first direction, and each of the at least one isolation trench extending through the drive backplane;
• and
• the stress absorbing layer is disposed in the bending region and comprises a plurality of absorbing portions arranged along the second direction, at least one of the plurality of absorbing portions being provided on both sides of each of the at least one isolation trench,
• wherein the isolation trench comprises an open end and a closed end that are arranged along the first direction, the closed end being proximal to the pixel circuit region relative to the open end, and wherein the isolation trench comprises a first trench wall and a second trench wall that are arranged in parallel, and a bottom wall configured to connect the first trench wall and the second trench wall, the bottom wall being in smooth transition with the first trench wall and the second trench wall, the bottom wall is in an arc shape, and a distance between the first trench wall and the second trench wall is greater than or equal to twice a radius of the bottom wall.