Ferroelectric tunnel junction memory device using a magnesium oxide tunneling dielectric and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMauricio Manfrini, Bo-Feng Young, Chun-Chieh Li, Han-Jong Chia, Sai-Hooi Yeong
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Abstract
A ferroelectric tunnel junction (FTJ) memory device includes a bottom electrode located over a substrate, a top electrode overlying the bottom electrode, and a ferroelectric tunnel junction memory element located between the bottom electrode and the top electrode. The ferroelectric tunnel junction memory element includes at least one ferroelectric material layer and at least one tunneling dielectric layer.
Claims20
A method of manufacturing a ferroelectric tunnel junction (FTJ) memory device, the method comprising:
- forming a layer stack including a bottom electrode material layer, ferroelectric tunnel junction material layers, and a top electrode material layer over a substrate, wherein the ferroelectric tunnel junction material layers comprise at least one ferroelectric material layer and at least one tunneling dielectric layer;
- masking a region of the layer stack with an etch mask;
- and
- forming a ferroelectric tunnel junction (FTJ) memory cell by etching unmasked portions of the layer stack that are not masked by the etch mask.
A method of manufacturing a ferroelectric tunnel junction (FTJ) memory device, the method comprising:
- forming a layer stack including a bottom electrode material layer, ferroelectric tunnel junction material layers, and a top electrode material layer over a substrate, wherein the ferroelectric tunnel junction material layers comprise at least one ferroelectric material layer and at least one tunneling dielectric layer;
- and
- patterning the layer stack into a two-dimensional array of ferroelectric tunnel junction memory cells, wherein each of the ferroelectric tunnel junction memory cells comprises a bottom electrode that is patterned portion of the bottom electrode material layer, a ferroelectric tunnel junction memory element that is a patterned portion of the ferroelectric tunnel junction material layers, and a top electrode that is a patterned portion of the top electrode material layer.
A method of forming a ferroelectric tunnel junction (FTJ) memory array, the method comprising:
- forming an array of transistors located on, or over, a substrate;
- and
- forming a layer stack including a bottom electrode material layer, ferroelectric tunnel junction material layers, and a top electrode material layer over a substrate prior to, or after, formation of the array of transistors, wherein the ferroelectric tunnel junction material layers comprise at least one ferroelectric material layer and at least one tunneling dielectric layer;
- and
- patterning the layer stack into a two-dimensional array of ferroelectric tunnel junction memory cells;
- and
- providing electrical connections between the array of transistors and the two-dimensional array of ferroelectric tunnel junction memory cells such that each of the transistors comprises an access transistor for a respective one ferroelectric tunnel junction memory cell within the two-dimensional array of ferroelectric tunnel junction memory cells.
Dependencies are inferred from the claim text.