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US 12,120,871 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeSK hynix Inc.
InventorNam Jae Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor device may include a first cell structure, a second cell structure, a pad structure, a circuit, and one or more openings. The pad structure may be disposed between the first cell structure and the second cell structure, and may be electrically coupled to the first and second cell structures. The pad structure may have a plurality of stepped structures. The circuit may be disposed under the pad structure. The one or more openings may pass through the pad structure, and may expose the circuit. The one or more openings may be disposed between the plurality of stepped structures.
Claims5
A semiconductor device, comprising:
- a circuit;
- a pad structure located over the circuit, the pad structure comprising a first stepped structure including first pads stacked on top of one another, a second stepped structure including second pads stacked on top of one another, and a third stepped structure including third pads stacked on top of one another;
- a first interconnection structure electrically coupling the first pads and the third pads to each other and coupling the first and third pads to the circuit through a first opening;
- and
- a second interconnection structure electrically coupling the second pads to each other and coupling the second pads to the circuit through a second opening.
2 more elements
Dependencies are inferred from the claim text.