Electromagnetic wave shielding film and shielded printed wiring board

A shielded printed wiring board, comprising:

• a printed wiring board including a base film, a printed circuit arranged on the base film, and a coverlay arranged so as to cover the printed circuit;
• and
• an electromagnetic wave shielding film including an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition,
• the electromagnetic wave shielding film being arranged on the printed wiring board such that the electroconductive adhesive layer is in contact with the coverlay,
• the electroconductive particles including flaky electroconductive particles and spherical electroconductive particles,
• an average particle size of the spherical electroconductive particles being 1 to 10 μm,
• a content of the flaky electroconductive particles and the spherical electroconductive particles in the electroconductive adhesive layer being 70 to 80% by weight,
• a weight ratio of the flaky electroconductive particles to the spherical electroconductive particles, [flaky electroconductive particles]/[spherical electroconductive particles], being 6/4 to 8/2,
• a thickness of the electroconductive adhesive layer being 5 to 20 μm, and
• the electroconductive particles being copper and/or silver-coated copper.