Immersion cooling systems for electronic components

A cooling system for liquid immersion cooling of a heat-generating electronic component, comprising:

• an immersion case comprising:
• a top open aperture to receive and house immersion cooling liquid and the electronic component submerged in the immersion cooling liquid,
• a liquid level sensor configured to detect a height fluid level of the immersion cooling liquid within the immersion case,
• a bladder, containing a bladder fluid, configurable between an expanded state and a contracted state and positioned such that the bladder is at least partially submerged in the immersion cooling liquid when in the expanded state and the contracted state;
• and
• a controller operatively-coupled to the liquid level sensor and the bladder to modulate the bladder between the expanded state and the contracted state based on the detected height fluid level of the immersion cooling liquid to maintain the electronic component submerged within the immersion cooling liquid.