Power module with output inductors and output capacitors that are embedded within substrate layers

A power module comprising:

• a printed circuit board (PCB) comprising an output capacitor substrate layer and an output inductor substrate layer;
• a first power converter that generates a first output voltage at a first output voltage node, one or more components of the first power converter being mounted on a topmost surface of the PCB;
• a first output inductor that is embedded within the output inductor substrate layer, the first output inductor being connected to the first output voltage node;
• a first output capacitor that is embedded within the output capacitor substrate layer, the first output capacitor having a first end that is connected to the first output voltage node and a second end that is connected to ground,
• a second power converter that generates a second output voltage at a second output voltage node, one or more components of the second power converter being mounted on the topmost surface of the PCB;
• a second output inductor that is embedded within the output inductor substrate layer, the second output inductor being connected to the second output voltage node;
• and
• a second output capacitor that is embedded within the output capacitor substrate layer, the second output capacitor having a first end that is connected to the second output voltage node and a second end that is connected to ground.

A power module comprising:

• a printed circuit board (PCB) comprising an output capacitor substrate layer and an output inductor substrate layer;
• a first monolithic integrated circuit (IC) switch block mounted on a top surface of the output inductor substrate layer, the first monolithic IC switch block comprising a switch that is connected to a first output voltage node;
• a second monolithic IC switch block mounted on the top surface of the output inductor substrate layer, the second monolithic IC switch block comprising a switch that is connected to a second output voltage node;
• a first output inductor that is embedded within the output inductor substrate layer, the switch of the first monolithic IC switch block being connected to the first output voltage node by way of the first output inductor;
• a second output inductor that is embedded within the output inductor substrate layer, the switch of the second monolithic IC switch block being connected to the second output voltage node by way of the second output inductor;
• a first plurality of discrete capacitors that are connected in parallel, the first plurality of discrete capacitors being embedded within the output capacitor substrate layer, the first plurality of discrete capacitors being connected between the first output voltage node and ground;
• and
• a second plurality of discrete capacitors that are connected in parallel, the second plurality of discrete capacitors being embedded within the output capacitor substrate layer, the second plurality of discrete capacitors being connected between the second output voltage node and ground.