Multi-dielectric printed circuit board

A system, comprising:

• a printed circuit board (PCB) comprising:
• a first layer comprising a first dielectric material substantially exclusively;
• and
• a second layer comprising the first dielectric material within a first region and a second dielectric material within a second region adjacent to the first region, wherein:
• the first dielectric material has a first dielectric constant, a first coefficient of thermal expansion (CTE) and a first glass transition temperature (Tg);
• the second dielectric material has a second dielectric constant, a second CTE and a second Tg;
• the first dielectric constant is greater than the second dielectric constant;
• the first CTE is substantially equal to the second CTE;
• and
• the first Tg and the second Tg are greater than 150° C.,
• a first routing over the first region of the second layer;
• and
• a second routing over the second region of the second layer.

A method for making a printed circuit board (PCB), comprising:

• receiving a PCB layer stack comprising a core, wherein the core comprises a dielectric layer comprising a first dielectric material exclusively, wherein the first dielectric material has a first dielectric constant, and wherein a first conductive layer is over a first side of the first dielectric layer and a second conductive layer is over an opposing second side of the first dielectric layer;
• patterning the first conductive layer to form high-speed interface routing comprising a high-speed input/output (HSIO) interface routing and a high-speed parallel interface routing;
• laminating a first prepreg sheet comprising the first dielectric material over the first conductive layer, wherein the first prepreg sheet comprises one or more openings;
• and
• riveting a second prepreg sheet in the one or more openings in the first prepreg sheet, wherein the second prepreg sheet has a second dielectric constant that is substantially different than the first dielectric constant.