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US 12,119,857 B2Granted
Multilayer substrate and wireless module mounted substrate
AssigneeLapis Semiconductor Co., Ltd.
InventorShigeki Yamauchi
Life of this patent
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Abstract
A multilayer substrate includes a first dielectric layer, a first conductive layer, and a conductor portion. The first dielectric layer has a first region. The first conductive layer is laminated on the first dielectric layer, excluding the first region. The conductor portion has one or more auxiliary conductors disposed at a distance from the first conductive layer, and one or more connecting conductors that connect said one or more auxiliary conductors to the first conductive layer.
Claims9
A wireless module mounted substrate, comprising:
- a multilayer substrate comprising
- a first dielectric layer having a first region,
- a first conductive layer laminated on the first dielectric layer, excluding the first region, and
- a conductor portion having one or more auxiliary conductors disposed at a distance from the first conductive layer, and one or more connecting conductors that connect said one or more auxiliary conductors to the first conductive layer;
- and
- a wireless module having a main body including a communication circuit, and an antenna connected to the main body, the wireless module being mounted on the multilayer substrate such that the main body is located on the first conductive layer and the antenna is located on the first region of the first dielectric layer;
- wherein an edge of the first conductive layer opposite the conductor portion extends across a plurality of the auxiliary conductors.
4 more elements
A wireless module mounted substrate, comprising:
- a multilayer substrate comprising
- a first dielectric layer having a first region,
- a first conductive layer laminated on the first dielectric layer, excluding the first region, and
- a conductor portion having a plurality of auxiliary conductors formed in the first region of the first dielectric layer at a distance from the first conductive layer;
- and
- a wireless module having a main body including a communication circuit, and an antenna connected to the main body, the wireless module being mounted on the multilayer substrate such that the main body is located on the first conductive layer and the antenna is located on the first region of the first dielectric layer;
- wherein said plurality of auxiliary conductors each have a first connecting pad,
- wherein the first conductive layer has a plurality of second connecting pads, and
- wherein the first connecting pads and the second connecting pads are configured to be connected to each other by connecting lines made of a conductor, and
- wherein an edge of the first conductive layer opposite the conductor portion extends across a plurality of the auxiliary conductors.
7 more elements
Dependencies are inferred from the claim text.