Power amplifier module
AssigneeMurata Manufacturing Co., Ltd.
InventorsTakashi Yamada, Satoshi Tanaka, Yasuhisa Yamamoto
Life of this patent
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AssigneeMurata Manufacturing Co., Ltd.
InventorsTakashi Yamada, Satoshi Tanaka, Yasuhisa Yamamoto
Estimating the term…
A power amplifier module includes a substrate, an amplifier circuit including a plurality of transistors to be mounted on the substrate and a bump connected to the plurality of transistors, a harmonic termination circuit and an output matching circuit that are disposed in or on the substrate and configured to be electrically connected to the amplifier circuit, a connection pad disposed on the substrate and configured to be connected to the bump, and a plurality of connection wiring lines branching from the connection pad. The plurality of connection wiring lines include at least a first connection wiring line that connects the connection pad and the harmonic termination circuit to each other, a second connection wiring line that connects the connection pad and the output matching circuit to each other, and a third connection wiring line that connects the connection pad and an external power supply to each other.
A power amplifier module comprising:
Dependencies are inferred from the claim text.