Female connector and connector assembly

A connector combination comprising a male connector and a female connector, wherein:

• the male connector comprises a male terminal;
• the female connector is configured for being connected to a PCB board that is internally provided with a signal layer and a ground layer, the PCB board being provided on a surface thereof with conductive pads that are connected to the signal layer and the ground layer;
• and
• the female connector comprises:
• a female terminal having a first end for mating with the male connector, and a second end opposite to the first end, the second end being provided with a plurality of differential signal pairs arranged at intervals and ground pins each located between any two adjacent pairs of the differential signal pairs, the differential signal pairs being connectable to the signal layer through the conductive pads, the ground pins being connectable to the ground layer through the conductive pads, and a high-frequency radiation area being formed in the vicinity of a joint between the differential signal pairs and the conductive pads when the first end is mated with the male connector;
• and
• a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area.

A connector combination comprising a gold finger circuit board and a female connector, wherein:

• the gold finger circuit board comprises a gold finger insertion tip;
• the female connector is configured for being connected to a PCB board that is internally provided with a signal layer and a ground layer, the PCB board being provided on a surface thereof with conductive pads that are connected to the signal layer and the ground layer;
• and
• the female connector comprises:
• a female terminal having a first end for mating with the gold finger insertion tip, and a second end opposite to the first end, the second end being provided with a plurality of differential signal pairs arranged at intervals and ground pins each located between any two adjacent pairs of the differential signal pairs, the differential signal pairs being connectable to the signal layer through the conductive pads, the ground pins being connectable to the ground layer through the conductive pads, and a high-frequency radiation area being formed in the vicinity of a joint between the differential signal pairs and the conductive pads when the first end is mated with the gold finger insertion tip;
• and
• a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area.