Press-fit power module and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsJie Chang, Huibin Chen, Tiburcio Maldo, Keunhyuk Lee
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Abstract
Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.
Claims20
A method of manufacturing a semiconductor package, the method comprising:
- providing a power module comprising a first set of leads on a first side and a second set of leads on a second side;
- trimming a length of the first set of leads and a length of the second set of leads;
- one of welding, soldering, or brazing a press fit pin to each lead of the first set of leads and to each lead of the second set of leads to form a plurality of press fit pins;
- and
- bending the first set of leads and the second set of leads to a desired angle configured to couple with a substrate.
A method of manufacturing a semiconductor package, the method comprising:
- providing a power module comprising a first set of leads on a first side and a second set of leads on a second side;
- coupling a plurality of press fit pins into a jig;
- coupling a portion of each lead of the first set of leads into the jig;
- coupling a portion of each lead of the second set of leads into the jig;
- one of welding, soldering, or brazing a press fit pin of the plurality of press fit pins to each lead of the first set of leads and to each lead of the second set of leads;
- and
- bending the first set of leads and the second set of leads to a desired angle configured to couple with a substrate.
A method of manufacturing a semiconductor package, the method comprising:
- providing one or more die electrically coupled to a leadframe, the leadframe comprised within a housing, the leadframe comprising a first set of leads extending from the housing and a second set of leads extending from the housing opposite the first set of leads;
- trimming a length of the first set of leads and a length of the second set of leads;
- one of welding, soldering, or brazing a press fit pin to each lead of the first set of leads and to each lead of the second set of leads to form a plurality of press fit pins;
- and
- bending the first set of leads and the second set of leads to a desired angle configured to couple with a substrate.
Dependencies are inferred from the claim text.