Antenna module and communication device including the same

A communication device, comprising:

• an antenna module;
• and
• a mount substrate disposed across from the-an antenna substrate with a radio-frequency integrated circuit (RFIC) interposed therebetween, and on which the RFIC is mounted,
• wherein the antenna module including
• the antenna substrate including a first surface, a second surface opposite to the first surface, and an antenna element,
• the RFIC mounted on the second surface of the antenna substrate and connected to the antenna element, and
• a heat dissipator comprising a thermally conductive material,
• wherein the antenna substrate includes a mount portion on which the RFIC is mounted and an overhang portion that extends outward and away from the mount portion,
• wherein at least part of the antenna element is disposed in the overhang portion of the antenna substrate either on the first surface of the antenna substrate or within the antenna substrate between the first surface and the second surface of the antenna substrate,
• wherein the heat dissipator is disposed on the second surface of the antenna substrate in the overhang portion,
• wherein the overhang portion includes
• a first overhang portion that extends in a first direction, and
• a second overhang portion that extends in a second direction different from the first direction,
• wherein the antenna element includes
• a first antenna element disposed in the first overhang portion. and
• a second antenna element disposed in the second overhang portion, and wherein the heat dissipator includes
• a first heat dissipator disposed on the second surface of the antenna substrate in the first overhang portion, and
• a second heat dissipator disposed on the second surface of the antenna substrate in the second overhang portion.

An antenna module, comprising:

• an antenna substrate including a first surface, a second surface opposite to the first surface, and an antenna element;
• and
• a radio frequency integrated circuit (RFIC) mounted on the second surface of the antenna substrate and connected to the antenna element, wherein
• the antenna substrate includes a mount portion on which the RFIC is mounted, and an overhang portion that extends outward and away from the mount portion,
• at least part of the antenna element is disposed in the overhang portion of the antenna substrate either on the first surface of the antenna substrate or within the antenna substrate between the first surface and the second surface of the antenna substrate,
• the mount portion of the antenna substrate includes a rigid substrate and a flexible substrate laminated one on top of another,
• the overhang portion of the antenna substrate is formed from the flexible substrate without the rigid substrate, and
• the antenna module further comprises a heat dissipator that is in contact with the overhang portion, the heat dissipator comprising a thermally conductive material.