Systems and methods for encapsulating an electronic component

A method of encapsulating an electronic component on a surface of a substrate, the method comprising:

• applying a first layer of an encapsulation composition onto a substrate from an applicator roll, the applicator roll comprising an outer surface and being spaced apart from the substrate such that a gap exists between the applicator roll and the substrate, the gap controlling the thickness of the first layer of encapsulation composition,
• positioning an electronic component on the first layer of encapsulation composition;
• and
• applying a second layer of encapsulation composition onto the electronic component from the applicator roll, such that the electronic component is encapsulated within the encapsulating composition and the encapsulating composition is substantially free of voids.