A semiconductor device comprising an integrated vertical Schottky diode, said device comprising:
- a substrate of semiconductor material, having a front surface and a back surface and an integrated circuit formed therein;
- a lightly doped region formed in a surface portion of the substrate facing the front surface, having a first conductivity type;
- a first electrode formed on the lightly doped region on the front surface of the substrate, to establish a Schottky contact;
- a highly doped region at the back surface of the substrate, in contact with the lightly doped region and having the first conductivity type;
- a second electrode electrically in contact with the highly doped region, on the back surface of the substrate, to establish an Ohmic contact;
- further comprising an intermetal dielectric layer on the front surface of the substrate and at least a first frontside interconnection metal layer arranged in the intermetal dielectric layer above said front surface;
- a first interconnection pad defined in said first frontside interconnection metal layer and providing a first electrical contact available at the front surface, electrically contacting said first electrode via contacts extending through said intermetal dielectric layer;
- a second interconnection pad defined in said first frontside interconnection metal layer to provide a second electrical contact available at said front surface;
- a further intermetal dielectric layer above the back surface of the substrate and at least a first backside interconnection metal layer defining at least a first interconnection region arranged in the further intermetal dielectric layer;
- further comprising a through silicon via structure, including a dielectric liner and a conductive filling, and laterally enclosing said lightly doped region and said highly doped region, providing an electrical isolation, wherein said through silicon via structure:
- extends from said second interconnection pad to said at least first interconnection region which is in electrical contact with the second electrode, the conductive filling of the through silicon via structure establishing an electrical contact between the second electrode and the second interconnection pad,
- or extends from the first interconnection pad to a second interconnection region, the conductive filling of the through silicon via structure establishing an electrical contact between the first electrode and the second interconnection region, which thereby provides a first electrical contact available at said back surface.