Sensor package structure

A sensor package structure, comprising:

• a substrate having a first surface and a second surface that is opposite to the first surface;
• a sensor chip disposed on the first surface of the substrate and electrically coupled to the substrate, wherein a top surface of the sensor chip has a sensing region and a carrying region that is arranged outside of the sensing region;
• a ring-shaped supporting layer disposed on the carrying region of the sensor chip and surrounding the sensing region;
• and
• a light-permeable sheet having an outer surface and an inner surface that is opposite to the outer surface, wherein the light-permeable sheet has a ring-shaped notch recessed in a peripheral edge of the inner surface, and a depth of the ring-shaped notch with respect to the inner surface is at least 10 μm, and wherein the light-permeable sheet is disposed on the ring-shaped supporting layer through the ring-shaped notch, and the inner surface of the light-permeable sheet is not in contact with the ring-shaped supporting layer, so that the inner surface of the light-permeable sheet, an inner side of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space therein.