Semiconductor device packages, packaging methods, and packaged semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie Chen, Ying-Ju Chen, Hsien-Wei Chen
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Abstract
Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes an integrated circuit die mounting region and a molding material disposed around the integrated circuit die mounting region. An interconnect structure is disposed over the molding material and the integrated circuit die mounting region. A protection pattern is disposed in a perimeter region of the package. The protection pattern includes a conductive feature.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- forming a protection pattern and conductive redistribution elements located in multiple metallization layers over an encapsulant, the protection pattern being located within a dielectric material isolating the protection pattern;
- placing external connections in connection with the conductive redistribution elements, the external connections being the only external connections on a first side of the dielectric material, and wherein the protection pattern is electrically isolated from the external connections;
- and
- bonding a packaged semiconductor device to the external connections.
A method of manufacturing a semiconductor device, the method comprising:
- forming a conductive redistribution layer extending over both a first semiconductor device and an encapsulant adjacent to the first semiconductor device;
- forming a protection pattern located over the encapsulant, the protection pattern comprising a second conductive material that is electrically isolated from all elements below a surface of the encapsulant, the surface of the encapsulant facing the protection pattern, the protection pattern comprising a first conductive feature and a second conductive feature, the second conductive feature being separated from the first conductive feature by a dielectric material in a direction extending away from the encapsulant, wherein the dielectric material electrically isolates the protection pattern;
- and
- electrically connecting a package-on-package device to the first semiconductor device.
A method of manufacturing a semiconductor device, the method comprising:
- bonding a substrate to external connectors in electrical connection with a plurality of first conductive layers over both a semiconductor die and an encapsulant, wherein individual layers of the plurality of first conductive layers are aligned in a horizontal direction as seen in a cross-sectional view with respective ones of a plurality of second conductive layers overlying the encapsulant, wherein a dielectric material completely electrically isolates the plurality of second conductive layers from the plurality of first conductive layers and from the encapsulant, wherein each pad located on a side of the substrate facing the semiconductor die is connected to a respective one of the external connectors, wherein the substrate connects a first memory chip and a second memory chip to the external connectors;
- and
- connecting a printed circuit board to the semiconductor die, the printed circuit board being located on an opposite side of the semiconductor die from the substrate.
Dependencies are inferred from the claim text.