Method for manufacturing stack components

A method for manufacturing a stack component in which a circuit element is mounted on at least one circuit layer of multiple circuit layers to be stacked, the circuit layers are electrically connected by an interlayer connection pin, and an interposer is interposed to form a space for inserting the interlayer connection pin between the circuit layers, the method comprising:

• a printing step of simultaneously printing and forming the circuit layer and the interposer side by side in a planar manner by a 3D printer;
• a step of mounting the circuit element on the circuit layer;
• a step of mounting the interposer on the circuit layer;
• a step of inserting the interlayer connection pin into the interposer mounted on the circuit layer;
• and
• a step of electrically connecting the circuit layer and another circuit layer by the interlayer connection pin by stacking the other circuit layer on the circuit layer via the interposer.