Electronic devices and methods of manufacturing electronic devices

An electronic device, comprising:

• a substrate comprising:
• a dielectric structure comprising a dielectric structure top side and a dielectric structure bottom side opposite to the dielectric structure top side, wherein:
• the dielectric structure comprises:
• a via dielectric comprising a via dielectric bottom side that defines the dielectric structure bottom side and via dielectric top side opposite to the via dielectric bottom side;
• and
• a first dielectric comprising a first dielectric top side and a first dielectric bottom side that contacts the via dielectric top side;
• and
• the via dielectric comprise an aperture that extends from the via dielectric top side to the via dielectric bottom side;
• and
• a conductive structure comprising:
• a protruded via within the aperture and comprising a via tip that extends outward from the dielectric structure bottom side such that the dielectric structure bottom side and the via tip reside on different planes and a portion of the protruded via extends outside of the aperture to overlap the via dielectric top side;
• a seed over the via tip and over surfaces of the aperture between the via dielectric and the protruded via;
• and
• a substrate internal terminal at the dielectric structure top side and coupled to the protruded via;
• wherein:
• the first dielectric bottom side contacts the portion of the protruded via overlapping the via dielectric top side;
• an electronic component coupled to the substrate internal terminal at the dielectric structure top side;
• a body encapsulating the electronic component;
• and
• a terminal coupled to the protruded via;
• wherein:
• the via tip extends into the terminal.

A method for making an electronic device, comprising:

• providing a substrate comprising:
• a dielectric structure comprising a dielectric structure top side and a dielectric structure bottom side opposite to the dielectric structure top side, wherein:
• the dielectric structure comprises a via dielectric that defines the dielectric structure bottom side;
• and
• the via dielectric comprises an aperture;
• and
• a conductive structure comprising:
• a protruded via within the aperture and comprising a via tip that extends outward from the dielectric structure bottom side so that the dielectric structure bottom side and the via tip reside on different planes;
• a seed over surfaces of the aperture between the via dielectric and the protruded via;
• and
• a conductor at the dielectric structure top side and coupled to the protruded via;
• coupling an electronic component to the conductor at the dielectric structure top side;
• providing a body encapsulating the electronic component;
• and
• providing a terminal coupled to the protruded via;
• wherein:
• the via tip extends into the terminal;
• and
• providing the substrate comprises:
• providing the via dielectric comprising a height;
• providing the aperture in the via dielectric, wherein the aperture has a depth less than the height to define a lower dielectric under the aperture;
• providing the seed over the surfaces of the aperture;
• providing the protruded via over the seed and within the aperture;
• and
• removing a portion of the via dielectric including the lower dielectric to expose the via tip and define the dielectric structure bottom side.

An electronic device, comprising:

• a substrate comprising:
• a dielectric structure comprising a dielectric structure top side and a dielectric structure bottom side opposite to the dielectric structure top side;
• and
• a conductive structure comprising a protruded via that extends outward from the dielectric structure bottom side;
• an electronic component coupled to the conductive structure at the dielectric structure top side;
• and
• a terminal coupled to the protruded via such that the protruded via extends into the terminal;
• wherein:
• the dielectric structure comprises a via dielectric comprising a via dielectric bottom side that defines the dielectric structure bottom side and a via dielectric top side opposite to the via dielectric bottom side;
• the via dielectric comprises an aperture that extends from the via dielectric top side to the via dielectric bottom side;
• the protruded via is within the aperture;
• a portion of the protruded via extends out of the aperture at the via dielectric top side and overlaps onto via dielectric top side;
• the protruded via comprises a via tip comprising a rounded shape;
• the terminal comprises a pillar and a solder tip;
• and
• the via tip extends into the pillar.