Device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsCheng-Nan Lin, Wei-Tung Chang, Jen-Chieh Kao, Huei-Shyong Cho
Life of this patent
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Abstract
An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.
Claims10
An electronic device, comprising:
- a circuit structure;
- an antenna structure disposed over the circuit structure;
- a conductive element configured to transmit a radio frequency (RF) signal between the circuit structure and the antenna structure;
- and
- an encapsulant encapsulating the conductive element and including an indented portion having a first lateral side surface spaced apart from the conductive element,
- wherein the encapsulant has a first upper surface connected to the antenna structure and a second upper surface, and the first lateral side surface of the indented portion extends between the first upper surface and the second upper surface of the encapsulant,
- wherein the encapsulant further has a second lateral side surface spaced apart from the first lateral side surface and contacting the conductive element, and
- wherein a length of the second lateral side surface is greater than a length of the first lateral side surface in a cross-sectional view perspective.
An electronic device, comprising:
- a circuit structure comprising a first dielectric layer having a first modulus;
- an antenna structure supported by the circuit structure and comprising a dielectric element having a second modulus different from the first modulus;
- a conductive element configured to transmit a radio frequency (RF) signal between the circuit structure and the antenna structure;
- and
- an encapsulant encapsulating the conductive element, wherein the circuit structure further comprises a conductive pad connected to the conductive element and the encapsulant,
- wherein the encapsulant has a through hole having an upper opening and a lower opening, and wherein in a cross-sectional view perspective, a width of the upper opening is greater than a width of the conductive pad, and a width of the lower opening is less than the width of the conductive pad.
Dependencies are inferred from the claim text.