Integrated fuse

A method for manufacturing an integrated circuit, comprising:

• producing an initial integrated circuit in each first zone of plurality of first zones of a semiconductor wafer, where the first zones are separated from each other by a second zone defining a cutting line;
• wherein producing the initial integrated circuit comprises:
• producing at least one sealing ring at a periphery of the initial integrated circuit, said at least one sealing ring formed at least in part by a conductive contact wall;
• and
• producing at least one electrically conductive fuse extending between a first location inside the initial integrated circuit and a second location situated outside the initial integrated circuit beyond the cutting line, the at least one electrically conductive fuse passing through an opening in a bottom of the conductive contact wall of said at least one sealing ring and straddling said cutting line with a straddling portion;
• and
• slicing said straddling portion when cutting the semiconductor wafer along said cutting line to individualize the initial integrated circuit.