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US 12,119,307 B2Granted
Integrated self-aligned assembly
AssigneeRockley Photonics Limited
InventorsChia-Te Chou, Brett Sawyer, David McCann
Life of this patent
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Abstract
An assembly. In some embodiments, the assembly includes a first semiconductor chip, a substrate, and a first alignment element. The alignment of the first semiconductor chip and the substrate may be determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip.
Claims22
An assembly, comprising:
- a first semiconductor chip;
- a substrate;
- and
- a first alignment element,
- wherein the alignment of the first semiconductor chip and the substrate is determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip and extending part way through the first semiconductor chip, and
- wherein the first alignment element is a pin elongated along an axis, a first end of the pin being secured in a hole in the substrate, and the axis extending from the substrate to the first semiconductor chip.
3 more elements
An assembly, comprising:
- a first semiconductor chip;
- a substrate;
- and
- a first alignment element,
- wherein the alignment of the first semiconductor chip and the substrate is determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip and extending part way through the first semiconductor chip,
- wherein the first alignment element is a cylindrical pin extending along an axis and having:
- a first end at one end of the axis and that is secured in a hole in the substrate;
- and
- a second end at another end of the axis and that is round and engages the first recessed alignment feature.
6 more elements
An assembly, comprising:
- a first semiconductor chip;
- a substrate;
- and
- a first alignment element,
- wherein the alignment of the first semiconductor chip and the substrate is determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip,
- wherein the first alignment element is an elongated pin having a first end secured in a hole in the substrate,
- wherein:
- the first semiconductor chip is a photonic integrated circuit having an optical interface and an electrical interface, the photonic integrated circuit being configured to convert optical signals to electrical signals or to convert electrical signals to optical signals;
- or
- the assembly further comprises a photonic integrated circuit having an optical interface and an electrical interface, and being configured to convert optical signals to electrical signals or to convert electrical signals to optical signals, and
- wherein the assembly further comprises an interface integrated circuit connected to the electrical interface of the photonic integrated circuit, and connected, through a land grid array and through a socket, to the substrate.
8 more elements
Dependencies are inferred from the claim text.