Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

A package structure, comprising:

• a semiconductor die, disposed over a redistribution circuit structure;
• a reinforcement structure, embedded in the redistribution circuit structure, the reinforcement structure being partially overlapped with the semiconductor die, wherein the reinforcement structure extends along a portion of an edge of the semiconductor die;
• and
• a connecting structure, embedded in the redistribution circuit structure, wherein a projection of the connecting structure is laterally spacing from a projection of the semiconductor die, wherein in a vertical projection, a width of the reinforcement structure is greater than a width of the connecting structure.

A package structure, comprising:

• a first redistribution structure;
• a die, disposed over and electrically coupled to the first redistribution structure;
• an insulating encapsulation, encapsulating the die;
• a first reinforcement structure, embedded in the first redistribution structure and overlapped with the die and the insulating encapsulation in a vertical projection;
• a first connecting structure, embedded in the first redistribution structure and overlapped with the insulating encapsulation and offset from the die in the vertical projection, wherein a width of the first reinforcement structure is greater than the a width of the first connecting structure;
• an antenna element, disposed over the first redistribution structure and electrically coupled to the die;
• and
• an encapsulant, disposed between the antenna element and the die.