Semiconductor device with protection liners and air gaps and method for fabricating the same
AssigneeNanya Technology Corporation
InventorTe-Yin Chen
Life of this patent
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Abstract
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate having plurality of contacts, a plurality of composite plugs positioned above the plurality of contacts, a plurality of metal spacers positioned above the substrate; and a plurality of air gaps positioned above the substrate. At least one of the plurality of composite plugs includes a protection liner having a U-shaped profile and a metal plug in the protection liner, and the protection liner is in direct contact with one of the plurality of contacts.
Claims20
A semiconductor device, comprising:
- a substrate having plurality of contacts;
- a plurality of composite plugs positioned above the substrate, wherein at least one of the plurality of composite plugs includes a protection liner having a U-shaped profile and a metal plug in the protection liner, and the protection liner is in direct contact with one of the plurality of contacts;
- a plurality of metal spacers positioned above the plurality of composite plugs;
- and,
- a plurality of air gaps respectively positioned between the plurality of composite plugs.
A method for fabricating a semiconductor device, comprising:
- providing a substrate having a plurality of contacts;
- forming a plurality of composite plugs above the substrate, wherein at least one of the plurality of composite plugs includes a protection liner having a U-shaped profile and a metal plug in the protection liner, and the protection liner is in direct contact with one of the plurality of contacts;
- forming a plurality of metal spacers above the plurality of composite plugs;
- and,
- forming a plurality of air gaps positioned between the plurality of composite plugs.
Dependencies are inferred from the claim text.