Semiconductor device
AssigneeRohm Co., Ltd.
InventorsTakumi Kanda, Masaaki Matsuo, Soichiro Takahashi, Yoshitoki Inami, Kaito Inoue
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AssigneeRohm Co., Ltd.
InventorsTakumi Kanda, Masaaki Matsuo, Soichiro Takahashi, Yoshitoki Inami, Kaito Inoue
Estimating the term…
A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.
A semiconductor device comprising:
Dependencies are inferred from the claim text.