Semiconductor packages with roughened conductive components
AssigneeTexas Instruments Incorporated
InventorsYee Gin Tea, Chong Han Lim
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Abstract
In some examples, a semiconductor package comprises a die pad, a semiconductor die on the die pad, and a mold compound covering the die pad and the semiconductor die. The semiconductor package includes a conductive component including a roughened surface, the roughened surface having a roughness ranging from an arithmetic mean surface height (SA) of 1.4 to 3.2. The mold compound is coupled to the roughened surface. The semiconductor package includes a bond wire coupling the semiconductor die to the roughened surface. The bond wire is directly coupled to the roughened surface without a precious metal positioned therebetween.
Claims25
A semiconductor package, comprising:
- a die pad with a first roughened conductive surface;
- a conductive lead with a second roughened conductive surface, wherein the first and second roughened conductive surfaces include nodules of non-precious metal;
- a semiconductor die disposed over the first roughened conductive surface;
- and
- a bond wire coupling the semiconductor die to the second roughened conductive surface, the bond wire directly coupled to the second roughened conductive surface.
A semiconductor package, comprising:
- a conductive lead with a roughened conductive surface including nodules of non-precious metal;
- a solder ball directly coupled to the roughened conductive surface of the conductive lead;
- and
- a semiconductor die attached to the solder ball, the semiconductor die including a surface with a circuit formed therein, wherein the surface of the semiconductor die faces the solder ball.
Dependencies are inferred from the claim text.