Heat dissipation structure, method for forming heat dissipation structure, and semiconductor structure

A method for forming a heat dissipation structure, comprising:

• providing a chip at least comprising a through silicon via (TSV) passing through a silicon substrate and a dielectric layer;
• forming a first heat dissipation ring of the heat dissipation structure around the TSV in the dielectric layer, wherein the first heat dissipation ring is in contact with the TSV;
• and
• forming a second heat dissipation ring of the heat dissipation structure around the first heat dissipation ring, wherein the second heat dissipation ring is in contact with the first heat dissipation ring;
• the second heat dissipation ring has a heat dissipation gap in an interior of the second heat dissipation ring;
• a dimension of the second heat dissipation ring in a first direction is less than a dimension of the first heat dissipation ring in the first direction;
• and the first direction is a thickness direction of the silicon substrate.

A semiconductor structure, at least comprising

• a Through Silicon Via (TSV) and a heat dissipation structure comprising a first heat dissipation ring and at least one second heat dissipation ring, wherein
• the first heat dissipation ring is formed in a dielectric layer around the TSV and is in contact with the TSV, wherein the TSV passes through a silicon substrate of a chip and the dielectric layer located on a surface of the silicon substrate;
• the second heat dissipation ring is formed around the first heat dissipation ring and is in contact with the first heat dissipation ring, the second heat dissipation ring has a heat dissipation gap in an interior of the second heat dissipation ring, a dimension of the second heat dissipation ring in a first direction is less than a dimension of the first heat dissipation ring in the first direction, and the first direction is a thickness direction of the silicon substrate;
• the heat dissipation structure is formed in the dielectric layer around the TSV, and the heat dissipation structure is in contact with the TSV.