Method of making a semiconductor device package

A method of manufacturing a semiconductor device package, comprising:

• providing a substrate with a recess and an electronic component, wherein the electronic component is disposed over the substrate and outside the recess;
• forming a sacrificial material over the recess of the substrate;
• encapsulating the substrate and the sacrificial material by an encapsulant;
• removing a portion of the encapsulant to expose the sacrificial material;
• removing the sacrificial material;
• and
• after removing the sacrificial material, forming a concave recessed from a lower surface of the encapsulant, wherein the concave is in communication with an outside of the semiconductor device package through the recess;
• wherein the concave horizontally overlaps the electronic component.