Hermetic package for high CTE mismatch
AssigneeQorvo US, Inc.
InventorDylan Murdock
Life of this patent
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Abstract
The present disclosure relates to a hermetic package capable of handling a high coefficient of thermal expansion (CTE) mismatch configuration. The disclosed hermetic package includes a metal base and multiple segments that are discrete from each other. Herein, a gap exists between every two adjacent ceramic wall segments and is sealed with a connecting material. The ceramic wall segments with the connecting material form a ring wall, where the gap between every two adjacent ceramic wall segments is located at a corner of the ring wall. The metal base is either surrounded by the ring wall or underneath the ring wall.
Claims19
A package comprising:
- a metal base having a top surface;
- and
- multiple ceramic wall segments horizontally discrete from each other, wherein:
- a gap exists between every two horizontally adjacent ceramic wall segments and is sealed with a connecting material that is a solder or a brazing alloy, such that the connecting material is located at least between the every two horizontally adjacent ceramic wall segments;
- the ceramic wall segments with the connecting material form a ring wall, wherein the gap between the every two horizontally adjacent ceramic wall segments is located at a corner of the ring wall;
- and
- the ring wall is attached to the top surface of the metal base, such that a first portion of the top surface of the metal base is exposed through the ring wall.
Dependencies are inferred from the claim text.