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US 12,119,280 B2Granted
Semiconductor device package with reduced stress
AssigneeTexas Instruments Incorporated
InventorsGregory Thomas Ostrowicki, Amit Sureshkumar Nangia
Life of this patent
Estimating the term…
Abstract
A described example includes: a semiconductor device die with an active surface; the semiconductor device die mounted on a package substrate with substrate leads and the semiconductor device die electrically coupled to the substrate leads; at least a first rigid low expansion material (RLEM) covering a portion of the semiconductor device die; and the first RLEM, the semiconductor device die, and a portion of the substrate leads covered with mold compound and forming a packaged semiconductor device die.
Claims18
An apparatus, comprising:
- a semiconductor device die with an active surface;
- the semiconductor device die mounted on a package substrate with substrate leads and the semiconductor device die electrically coupled to the substrate leads;
- at least a first rigid low expansion material (RLEM) covering a portion of the semiconductor device die;
- and
- the first RLEM, the semiconductor device die, and a portion of the substrate leads covered with a mold compound and forming a packaged semiconductor device die;
- and p1 a second RLEM with a first side over a non-device side of the semiconductor device die, wherein the first RLEM and the second RLEM are of a same material, and wherein the first RLEM and the second RLEM physically contact the semiconductor device die without any intervening layers.
3 more elements
A packaged semiconductor device, comprising:
- a semiconductor device die with a device side and a non device side, the semiconductor device die mounted on a package substrate with substrate leads and the semiconductor device die electrically coupled to the substrate leads;
- a first material including ceramic covering a stress sensitive component in a portion of the active surface of the semiconductor device die;
- a second material including ceramic covering a non device side of the semiconductor device die;
- and
- the first material, the second material, the semiconductor device die, and a portion of the substrate leads covered with a mold compound, wherein the first material and the second material are of a same material, and wherein the first material and the second material physically contact the semiconductor device die without any intervening layers.
2 more elements
Dependencies are inferred from the claim text.