Semiconductor device having at least one resin part that closes one or more corresponding ones of a plurality of threaded holes

A semiconductor device to be mounted to a substrate, the semiconductor device comprising:

• a package to seal a semiconductor element;
• a lead frame having one end portion connected to the semiconductor element and an other end portion protruding from a side surface of the package;
• a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate;
• and
• at least one resin part that closes one or more corresponding ones of the threaded holes, at least one of the threaded holes being in an open state, the closed one or more corresponding ones of the threaded holes being visible from outside the package, where a lowest surface of the at least one resin part is offset from a lowest surface of the package.