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US 12,119,278 B2Granted
Method of manufacturing a supporting glass substrate
AssigneeNippon Electric Glass Co., Ltd.
InventorHiroki Katayama
Life of this patent
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Abstract
Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.
Claims10
A method of manufacturing a supporting glass substrate, the method comprising the steps of:
- preparing a supporting glass substrate free of any through holes, the supporting glass substrate comprising a first surface and a second surface opposite to the first surface;
- sandwiching the first surface and the second surface of the supporting glass substrate with a pair of polishing pads;
- and
- polishing the first surface and the second surface of the supporting glass substrate, which is free of any through holes, so that the supporting glass substrate has a total thickness variation of less than 5.0 μm while rotating the supporting glass substrate and the pair of polishing pads together so that a part of the supporting glass substrate intermittently extends off from the polishing pads during the polishing.
1 more element
Dependencies are inferred from the claim text.