Package structure with protective lid

A package structure, comprising:

• a substrate;
• a chip-containing structure over the substrate;
• and
• a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the first adhesive element and the second adhesive element are made of different materials, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and the first adhesive element is closer to a center of a side edge of the substrate than the second adhesive element.

A package structure, comprising:

• a substrate;
• a chip-containing structure over the substrate;
• and
• a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the first adhesive element and the second adhesive element are made of different materials, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.